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#hbm4 — Public Fediverse posts

Live and recent posts from across the Fediverse tagged #hbm4, aggregated by home.social.

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  1. RT @SebAaltonen: Die AMD MI4555X scheint großartig zu sein: 40 Petaflops MXFP6 (gemeinsamer Exponent → Qualität nahe an fp8). 432 GB RAM mit ~20 TB/s. MXFP6-quantisiertes Kimi K3 sollte auf 6 GPUs passen. Das sind rund 300.000 US-Dollar für unbegrenzte Frontier-Modell-Token für etwa 10 Entwickler… videocardz.com/newz/amd-inst… Link AMD Instinct MI455X GPU: 432 GB HBM4 und 23,3 TB/s Speicherbandbreite - VideoCardz.com Die neue Instinct-GPU verwendet ein Chiplet-Paket mit zwei Fabric-Dies und zwei I/O-Dies. Die maximale Speicherbandbreite beträgt 23,3 TB/s. videocardz.com

    mehr auf Arint.info

    #AI #AMD #GPU #HBM4 #MI455X #MXFP6 #arint_info

    https://x.com/SebAaltonen/status/2080496707406909455#m

  2. RT @SebAaltonen: Die AMD MI4555X scheint großartig zu sein: 40 Petaflops MXFP6 (gemeinsamer Exponent → Qualität nahe an fp8). 432 GB RAM mit ~20 TB/s. MXFP6-quantisiertes Kimi K3 sollte auf 6 GPUs passen. Das sind rund 300.000 US-Dollar für unbegrenzte Frontier-Modell-Token für etwa 10 Entwickler… videocardz.com/newz/amd-inst… Link AMD Instinct MI455X GPU: 432 GB HBM4 und 23,3 TB/s Speicherbandbreite - VideoCardz.com Die neue Instinct-GPU verwendet ein Chiplet-Paket mit zwei Fabric-Dies und zwei I/O-Dies. Die maximale Speicherbandbreite beträgt 23,3 TB/s. videocardz.com

    mehr auf Arint.info

    #AI #AMD #GPU #HBM4 #MI455X #MXFP6 #arint_info

    https://x.com/SebAaltonen/status/2080496707406909455#m

  3. RT @wccftech: TRANSLASHT: AMD bringt die Instinct MI455X GPU auf den Markt, einen 320 Milliarden Transistoren umfassenden Riesen, der entwickelt wurde, um NVIDIA's Rubin zu bekämpfen, mit 50 % mehr HBM4-Speicher und bis zu 40 PFLOPs an KI-Computing-Leistung. wccftech.com/amd-instinct-mi… Link AMD veröffentlicht Instinct MI455X GPU, ein 320 Milliarden Transistoren großes Monster, das entwickelt wurde, um... AMDs Instinct MI455X-GPUs erweitern die KI-Roadmap des Unternehmens und bieten führende HBM4-Kapazitäten und über 40 PFLOPs an Rechenleistung für Agentic AI, im Wettbewerb mit NVIDIAs Rubin-Chip. AMD hat eine Antwort auf NVIDIA's... wccftech.com

    mehr auf Arint.info

    #AICompute #AMD #HBM4 #InstinctMI455X #NVIDIA #Rivalry #arint_info

    https://x.com/wccftech/status/2080394171446067351#m

  4. Dentro la gerarchia della memoria delle GPU: come i server AI spostano i dati dagli SSD alla HBM

    Ti sei mai chiesto come i modelli di intelligenza artificiale trasferiscono i dati alla GPU? Questo articolo spiega in modo semplice i diversi livelli di memoria all'interno di un server AI, perché la memoria della GPU è diventata un collo di bottiglia e quali nuove tecnologie potrebbero migliorare le prestazioni dell'intelligenza artificiale.

    buysellram.com/blog/inside-the…

    #HBM #HBM4 #GPUMemory #AIInfrastructure #DataCenter #CXL #HighBandwidthFlash #AIHardware #MemoryHierarchy #AIInference #NVMe #ITAD

  5. Dentro la gerarchia della memoria delle GPU: come i server AI spostano i dati dagli SSD alla HBM

    Ti sei mai chiesto come i modelli di intelligenza artificiale trasferiscono i dati alla GPU? Questo articolo spiega in modo semplice i diversi livelli di memoria all'interno di un server AI, perché la memoria della GPU è diventata un collo di bottiglia e quali nuove tecnologie potrebbero migliorare le prestazioni dell'intelligenza artificiale.

    buysellram.com/blog/inside-the…

    #HBM #HBM4 #GPUMemory #AIInfrastructure #DataCenter #CXL #HighBandwidthFlash #AIHardware #MemoryHierarchy #AIInference #NVMe #ITAD

  6. A modern AI server runs five layers of memory, from nanosecond on-chip SRAM to petabyte-scale SSDs, and keeping the GPU fed is the whole engineering game. This piece walks the full hierarchy: why HBM became the bottleneck, why adding more isn't simple, and where HBF, CXL, and PIM fit into the next generation.

    buysellram.com/blog/inside-the

    #HBM #HBM4 #GPUMemory #AIInfrastructure #DataCenter #CXL #HighBandwidthFlash #AIHardware #MemoryHierarchy #AIInference #NVMe #ITAD #buysellram

  7. Why can't a GPU just carry more HBM? Interposers max out in size, stacking 12 to 16 DRAM dies compounds yield losses, and every stack sits beside a kilowatt-class package that hates sharing heat. So capacity climbs in careful steps — 80 GB on the H100, 141 on the H200, 192 on the B200, 288 on Blackwell Ultra — while KV caches for long-context inference balloon past 40 GB per request.

    That gap between what models demand and what packaging permits is reshaping server design. NVIDIA's Rubin platform treats CPU memory and HBM as one coherent pool. SanDisk and SK hynix are standardizing High Bandwidth Flash as a capacity tier under HBM, with first samples due this half. CXL 4.0 pooling hardware is landing in racks now.

    This article walks the whole memory hierarchy, from on-chip SRAM to NVMe, and explains what each emerging technology actually solves — and what it doesn't.

    buysellram.com/blog/inside-the

    #HBM #HBM4 #GPUMemory #AIInfrastructure #DataCenter #CXL #HighBandwidthFlash #AIHardware #MemoryHierarchy #AIInference #NVMe #ITAD #technology

  8. Why can't a GPU just carry more HBM? Interposers max out in size, stacking 12 to 16 DRAM dies compounds yield losses, and every stack sits beside a kilowatt-class package that hates sharing heat. So capacity climbs in careful steps — 80 GB on the H100, 141 on the H200, 192 on the B200, 288 on Blackwell Ultra — while KV caches for long-context inference balloon past 40 GB per request.

    That gap between what models demand and what packaging permits is reshaping server design. NVIDIA's Rubin platform treats CPU memory and HBM as one coherent pool. SanDisk and SK hynix are standardizing High Bandwidth Flash as a capacity tier under HBM, with first samples due this half. CXL 4.0 pooling hardware is landing in racks now.

    This article walks the whole memory hierarchy, from on-chip SRAM to NVMe, and explains what each emerging technology actually solves — and what it doesn't.

    buysellram.com/blog/inside-the

  9. A modern AI server runs five layers of memory, from nanosecond on-chip SRAM to petabyte-scale SSDs, and keeping the GPU fed is the whole engineering game. This piece walks the full hierarchy: why HBM became the bottleneck, why adding more isn't simple, and where HBF, CXL, and PIM fit into the next generation.

    buysellram.com/blog/inside-the

    #HBM #HBM4 #GPUMemory #AIInfrastructure #DataCenter #CXL #HighBandwidthFlash #AIHardware #MemoryHierarchy #AIInference #NVMe #tech

  10. A modern AI server runs five layers of memory, from nanosecond on-chip SRAM to petabyte-scale SSDs, and keeping the GPU fed is the whole engineering game. This piece walks the full hierarchy: why HBM became the bottleneck, why adding more isn't simple, and where HBF, CXL, and PIM fit into the next generation.

    buysellram.com/blog/inside-the

    #HBM #HBM4 #GPUMemory #AIInfrastructure #DataCenter #CXL #HighBandwidthFlash #AIHardware #MemoryHierarchy #AIInference #NVMe #tech

  11. ⚙️ JEDEC approva SPHBM4: HBM4 più accessibile per accelerare l’AI, ridurre i costi e aprire nuove prospettive per chip e data center. #AI #HBM4

    🔗 tomshw.it/hardware/hbm4-piu-ec

  12. Optical Links Rethink AI's Memory Bind

    How will optical links change AI memory in May 2026? Learn why moving from physical stacking to light signals helps AI processors run faster.

    #aimemory, #opticalinterconnect, #hbm4, #techinnovation, #aihardware

    newsletter.tf/optical-links-ai

  13. Engineers are moving away from stacking memory chips to using light. This new method could increase AI memory capacity by several times compared to current limits.

    #aimemory, #opticalinterconnect, #hbm4, #techinnovation, #aihardware
    newsletter.tf/optical-links-ai

  14. The Samsung Electronics union has announced a general strike from May 21 to June 7. The dispute originated from differences between labor and ...

    Samsung Electronics files injunction against union strike citing potential 30 trillion won losses, risks to semiconductor facilities, and threats to Korea's economy as company accounts for 41% of KOSPI.#SamsungElectronics #unionstrike #semiconductorindustry #injunction #KOSPI #HBM4 #supplychaindisruption #Koreaeconomy
    Samsung Seeks Injunction Against Union Strike, Warns of 30 Trillion Won-Plus Losses

  15. On the very same day the MoU was announced, the union at Samsung voted overwhelmingly—93.1% in favor—to authorize an 18-day general strike set to ...#AMDs #Strategic #Ambitions #Face #Supply #Chain #Headwinds #AMD #Samsung #HBM4
    AMD's Strategic Ambitions Face Supply Chain Headwinds
  16. Samsung se convierte en el «cerebro» de OpenAI: Suministrará en exclusiva los chips y la memoria para ChatGPT

    En un movimiento que redefine el equilibrio de poder en la industria tecnológica, Samsung ha cerrado un acuerdo histórico con OpenAI para convertirse en el proveedor exclusivo de la infraestructura de semiconductores que dará vida a las futuras versiones de ChatGPT. Se ha confirmado que la división de fundición de Samsung y sus memorias de última generación (HBM4) serán el motor detrás de la inteligencia artificial más utilizada del mundo (Fuente Hankyung).

    Esta alianza llega en un momento crítico para Samsung, compensando el sabor agridulce de la cancelación del Galaxy Z TriFold y los problemas de fatiga ocular en el S26 Ultra con un contrato multimillonario que asegura su dominio en el sector de los centros de datos.

    ¿Qué implica este acuerdo para el futuro de la IA?

    Hasta ahora, OpenAI dependía en gran medida de chips de terceros (principalmente NVIDIA) y diversas cadenas de suministro. Con este pacto:

    • Chips a medida (ASIC): Samsung fabricará procesadores diseñados específicamente por y para los modelos de lenguaje de OpenAI, optimizando el consumo energético y la velocidad de respuesta.
    • Memoria HBM4 de 16 capas: Samsung suministrará su memoria de banda ancha más avanzada, fundamental para que la IA procese trillones de parámetros en milisegundos.
    • Independencia de la cadena de suministro: Sam Altman, CEO de OpenAI, busca con esto reducir la dependencia de un solo proveedor y asegurar el stock necesario para el despliegue global de sus próximos modelos.

    El impacto en el ecosistema Galaxy

    Aunque el acuerdo se centra en la infraestructura de servidores, los usuarios finales de Samsung verán beneficios directos:

    1. Integración Profunda: Se espera que los futuros dispositivos Galaxy (como el rumoreado S27) incluyan funciones de IA «on-device» optimizadas por este hardware conjunto, superando en velocidad a lo que Apple ofrece actualmente en iOS.
    2. Exclusividad de Funciones: OpenAI podría lanzar funciones de ChatGPT de forma prioritaria para los usuarios de Samsung, similar a lo que hemos visto esta semana con la llegada de WhatsApp nativo a los relojes Garmin.

    Un marzo de alianzas y tensiones

    El anuncio de Samsung y OpenAI es la pieza que faltaba en el rompecabezas de marzo de 2026:

    • Privacidad: Mientras el FBI admite la compra de datos de ubicación, OpenAI y Samsung prometen que su infraestructura conjunta permitirá un procesamiento de datos más seguro y localizado.
    • Competencia: Este movimiento responde directamente a la expansión de Claude de Anthropic, que recientemente duplicó sus límites de uso, y al lanzamiento del navegador Comet de Perplexity.
    • Economía: Tras el «Impuesto TikTok» de 10.000 millones, los grandes contratos de infraestructura como este demuestran que el verdadero valor de la tecnología hoy reside en quién controla el hardware que procesa la inteligencia.

    ¿Cuándo veremos los resultados?

    La producción a gran escala de los nuevos chips comenzará en la segunda mitad de 2026. Para los usuarios de ChatGPT, esto se traducirá en una menor latencia y capacidades multimodales más fluidas (voz y vídeo en tiempo real sin esperas) antes de que termine el año.

    #arielmcorg #chatgpt #HBM4 #infosertec #innovación #InteligenciaArtificial #openai #PORTADA #SamAltman #Samsung #semiconductores #TechNews2026 #tecnología
  17. 삼성·엔비디아 HBM4 동맹, AI 반도체 새 역사

    엔비디아 GTC에서 삼성전자가 차세대 HBM4를 공개하며 AI 반도체 동맹을 한층 강화했습니다. 더 빠른 속도와 높은 전력 효율을 갖춘 HBM4는 글로벌 AI 인프라의 핵심 부품으로 주목받고 있습니다.

    #삼성전자 #엔비디아 #HBM4 #AI반도체 #GTC2025 #블로그 #ODOB

  18. Inference is becoming the primary cost center of AI, and NVIDIA’s Feynman roadmap suggests a shift from training-centric GPUs toward latency-optimized, inference-scale systems.

    As real-time agents, copilots, and edge deployments grow, inference sovereignty—where compute is located, how fast it responds, and who controls the hardware—will define the next phase of AI infrastructure.

    With NVIDIA GTC 2026 approaching, the key question is whether NVIDIA will formally introduce a new class of inference-focused silicon and fabric to complement its training platforms.

    buysellram.com/blog/nvidia-nex

    #InferenceSovereignty #LLMInference #AgenticAI #NVIDIA #Feynman #HBM4 #SRAM #AdvancedPackaging #SiliconPhotonics #AIInfrastructure #GPU #GTC2026 #Rubin #Blackwell #DeterministicCompute #LPX #GroqLPU #technology

  19. #Samsung will die #KI-Branche zur Kasse bitten: Für #HBM4-#Speicher sollen #Nvidia und Co. rund 700 Dollar pro Modul zahlen - 30% mehr als ursprünglich erwartet. winfuture.de/news,156984.html?

  20. #Samsung will die #KI-Branche zur Kasse bitten: Für #HBM4-#Speicher sollen #Nvidia und Co. rund 700 Dollar pro Modul zahlen - 30% mehr als ursprünglich erwartet. winfuture.de/news,156984.html?

  21. #Nvidia-Chef Jensen Huang verspricht zur GTC 2026 einen Chip, der "die Welt überraschen" wird. Nach einem Treffen mit SK Hynix deutet vieles auf die neue Rubin-Architektur mit #HBM4-Speicher hin. winfuture.de/news,156973.html?

  22. #Nvidia-Chef Jensen Huang verspricht zur GTC 2026 einen Chip, der "die Welt überraschen" wird. Nach einem Treffen mit SK Hynix deutet vieles auf die neue Rubin-Architektur mit #HBM4-Speicher hin. winfuture.de/news,156973.html?

  23. Nvidia, Rubin AI GPU'lar için HBM4 bellek hız beklentilerini düşürdü. Amaç, tedarik hacmini güvence altına almak. Yapay zeka donanım tedarik zincirinde stratejik bir hamle!

    🚩 #Nvidia #YapayZeka #HBM4 #GPU #Teknoloji #AI

  24. Demis Hassabis warnt vor einem massiven Ungleichgewicht: Software skaliert, Hardware limitiert. HBM4-Speicher ist bis Ende 2026 komplett ausverkauft, da Hyperscaler die globale Produktion binden. Für Neueinsteiger schließt sich das Fenster fast vollständig. Energiekosten und Nvidias Preispolitik verschärfen die Lage drastisch. Innovation scheitert gerade an der Supply Chain. #Nvidia #OpenAI #HBM4
    all-ai.de/news/beitrage2026/ki

  25. Demis Hassabis warnt vor einem massiven Ungleichgewicht: Software skaliert, Hardware limitiert. HBM4-Speicher ist bis Ende 2026 komplett ausverkauft, da Hyperscaler die globale Produktion binden. Für Neueinsteiger schließt sich das Fenster fast vollständig. Energiekosten und Nvidias Preispolitik verschärfen die Lage drastisch. Innovation scheitert gerade an der Supply Chain. #Nvidia #OpenAI #HBM4
    all-ai.de/news/beitrage2026/ki

  26. Samsung is Back. The AI giants have spoken, and the HBM4 is a beast!

    Samsung Electronics has officially kicked off 2026 with a massive "mic drop" in the semiconductor world. In a New Year address, co-CEO Jun Young-hyun revealed that the company's next-gen HBM4 (6th-gen High Bandwidth Memory) has received glowing reviews from major AI customers.

    #samsungs #hbm4 #samsungisback #aitech #semiconductors #nvidia

  27. Samsung is Back. The AI giants have spoken, and the HBM4 is a beast!

    Samsung Electronics has officially kicked off 2026 with a massive "mic drop" in the semiconductor world. In a New Year address, co-CEO Jun Young-hyun revealed that the company's next-gen HBM4 (6th-gen High Bandwidth Memory) has received glowing reviews from major AI customers.

    #samsungs #hbm4 #samsungisback #aitech #semiconductors #nvidia

  28. Ah yes, the elusive #HBM4 standard is being developed to revolutionize our world by... reducing pin counts. 🙄 Too bad the details are as accessible as an invite to the Illuminati's annual gala—403 Forbidden, indeed. 🔒 Kudos to #JEDEC for teasing us with the tech version of a "no entry" sign. 🚫
    blocksandfiles.com/2025/12/17/ #technology #pin-counts #innovation #403Forbidden #HackerNews #ngated

  29. Ah yes, the elusive #HBM4 standard is being developed to revolutionize our world by... reducing pin counts. 🙄 Too bad the details are as accessible as an invite to the Illuminati's annual gala—403 Forbidden, indeed. 🔒 Kudos to #JEDEC for teasing us with the tech version of a "no entry" sign. 🚫
    blocksandfiles.com/2025/12/17/ #technology #pin-counts #innovation #403Forbidden #HackerNews #ngated

  30. Intel EMIB封裝技術會成為AI晶片的未來嗎? - 電子工程專輯

    Link
    Intel EMIB 封裝技術會成為 AI 晶片的未來嗎?
    https://www.eetimes.com/intel-emib-ai-chip-future/

    📌 Summary:
    本文深入探討了 Intel 的 Embedded Multi-die Interconnect Bridge(EMIB)封裝技術,及其在 AI 與高效能運算(HPC)晶片未來發展中的關鍵角色。隨著單一裸晶尺寸及製程極限的挑戰,2.5D 封裝方案成為後摩爾時代提升晶片性能與整合度的重要路徑。Intel EMIB 利用矽橋橋接多片裸晶,相較於基於矽中介層的傳統 2.5D 封裝,具備更佳的晶圓利用率及成本效益。文章分析了 EMIB 封裝的製造流程、設計挑戰、材料與工藝要求,以及兩種不同規格凸塊的應用。更進一步,EMIB 技術的最新進化版 EMIB-T 導入矽穿孔(TSV),大幅提升供電效率與互連速度,支援更高速的儲存介面如 HBM4/4e,明顯鎖定 AI 與 HPC 晶片市場需求。此外,Intel Foundry 利用其強大的封裝產能與生態系,推廣 EMIB 成為重要後段封裝技術。整體而言,EMIB 技術以其高晶圓利用率、成本優勢及靈活封裝設計,有望成為 AI 晶片及高效能系統晶片關鍵解決方案。

    🎯 Key Points:
    ★ 2.5D/3D 封裝與 chiplet 技術:
    ① 單裸晶尺寸與製程光罩極限限制多晶體數量。
    ② 多晶片透過先進封裝縫合或堆疊,提高效能與整合度。
    ③ 不同晶片可用不同製程製造,提高成本效益。

    ★ Intel EMIB 封裝特色與製程:
    → 使用小片矽橋置入封裝基板開槽區域,連接裸晶間訊號。
    → 相較矽中介層,EMIB 矽橋晶圓利用率達 90%,節省製造成本。
    → 需雙規格凸塊(C4 與 C2)配合橋與基板連接。
    → 製程挑戰包含基板內建腔體建置、鍵合過程、翹曲與訊號完整性控制。

    ★ EMIB 技術應用實例與競爭:
    → 2018 年 Intel Core 第 8 代 Kaby Lake-G首度量產應用。
    → 競爭方案如臺積電 CoWoS 與 InFO-LSI。
    → 其他業者及技術如 IBM DBHi、Fan-out EMC 橋方案亦在發展中。

    ★ 最新 EMIB-T 技術進化:
    → 加入矽穿孔(TSV),提升供電效率與訊號頻寬,降低壓降。
    → 支援更高頻寬儲存(HBM4/4e)及 UCIe-A 互連,資料率可達 32Gb/s 以上。
    → 封裝尺寸擴大至 120 × 180 mm,可整合多達 38 個矽橋與 12 片光罩尺寸裸晶。
    → 凸塊間距從 55μm 降至 45μm,朝 35μm 甚至 25μm 發展。
    → EMIB 與 EMIB-T 的資料傳輸能效分別約 0.3pJ/bit 與 0.25pJ/bit。

    ★ 市場與產能佈局:
    → Intel Foundry 推動 EMIB 支援多種晶圓代工裸晶,強化生態系。
    → 擁有超過同業兩倍的 2.5D 封裝產能,應對 AI 晶片快速成長需求。
    → EMIB 技術成為 Intel 及整個半導體產業邁向 AI 與 HPC 晶片封裝的關鍵技術路線。

    🔖 Keywords:
    #Intel_EMIB #2.5D_封裝 #AI_晶片 #矽橋_Silicon_Bridge #EMIB-T #HPC #HBM4 #矽穿孔_TSV #先進封裝 #chiplet

  31. NextGen #MI450 #AI Lineup, #AMD Says There Will Be ‘No Excuses, No Hesitation’ in Choosing Team Red Over NVIDIA In AI Workloads
    In terms of what to expect with #MI400 lineup, you are looking at integration of #HBM4, up to 432 GB, this will bring massive bandwidth improvements. AMD plans to aggressively expand #rackscale options with MI400 series as well, introducing highly anticipated #Helios rack as well, which is claimed to rival Vera Rubin's top configuration on-paper.
    wccftech.com/with-the-mi450-am