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#mi300 — Public Fediverse posts

Live and recent posts from across the Fediverse tagged #mi300, aggregated by home.social.

  1. even with constraints amd will have steppings and respins of the silicon plus driver improvements - memory speeds should continue to go up, zen6 will probably jump to ddr6 and pci-e v6 to continue to boost i/o and make compute faster - the real gains are for enterprise data chips where inference is going to go through the roof #mi300 #mi350 #mi400

  2. #AMD bets demand for its #MI300 accelerator will balance dips across other product lines
    CEO #LisaSu boasted AMD now predicts #datacenter GPUs – this includes the #MI300A – to see consistent sequential growth over the next several quarters, driving revenues of $3.5 billion in 2024 alone. Tthe MI300 represents AMD’s first compelling contender in the #AI arena, with its previous-gen #MI200 parts primarily designed for #highperformancecomputing (#hpc) deployments
    theregister.com/2024/01/31/amd #GPU #APU

  3. Cross post from birdsite: Confirmed by Nicholas Malaya of #AMD, #MI300, the new/upcoming datacentre #APU will present itself as a *single* GPU device in ROCm!

    Unlike MI250 which used 2 compute dies over a high speed interface, presenting as 2 devices, MI300 will display all of its #CDNA chiplets as a single device, similar to how the newest #RDNA3 consumer cards are based around a multi die approach (even if those are a single graphics die and multiple memory die)

    twitter.com/nicholasmalaya/sta

  4. Cross post from birdsite: Confirmed by Nicholas Malaya of #AMD, #MI300, the new/upcoming datacentre #APU will present itself as a *single* GPU device in ROCm!

    Unlike MI250 which used 2 compute dies over a high speed interface, presenting as 2 devices, MI300 will display all of its #CDNA chiplets as a single device, similar to how the newest #RDNA3 consumer cards are based around a multi die approach (even if those are a single graphics die and multiple memory die)

    twitter.com/nicholasmalaya/sta

  5. Cross post from birdsite: Confirmed by Nicholas Malaya of #AMD, #MI300, the new/upcoming datacentre #APU will present itself as a *single* GPU device in ROCm!

    Unlike MI250 which used 2 compute dies over a high speed interface, presenting as 2 devices, MI300 will display all of its #CDNA chiplets as a single device, similar to how the newest #RDNA3 consumer cards are based around a multi die approach (even if those are a single graphics die and multiple memory die)

    twitter.com/nicholasmalaya/sta

  6. Cross post from birdsite: Confirmed by Nicholas Malaya of #AMD, #MI300, the new/upcoming datacentre #APU will present itself as a *single* GPU device in ROCm!

    Unlike MI250 which used 2 compute dies over a high speed interface, presenting as 2 devices, MI300 will display all of its #CDNA chiplets as a single device, similar to how the newest #RDNA3 consumer cards are based around a multi die approach (even if those are a single graphics die and multiple memory die)

    twitter.com/nicholasmalaya/sta

  7. Cross post from birdsite: Confirmed by Nicholas Malaya of #AMD, #MI300, the new/upcoming datacentre #APU will present itself as a *single* GPU device in ROCm!

    Unlike MI250 which used 2 compute dies over a high speed interface, presenting as 2 devices, MI300 will display all of its #CDNA chiplets as a single device, similar to how the newest #RDNA3 consumer cards are based around a multi die approach (even if those are a single graphics die and multiple memory die)

    twitter.com/nicholasmalaya/sta