#hotchips2026 — Public Fediverse posts
Live and recent posts from across the Fediverse tagged #hotchips2026, aggregated by home.social.
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Arm’s AGI Data Center CPU at Hot Chips 2026
At Hot Chips 2026, Arm is showcasing their AGI data center CPU, the company's first complete commercial CPU design. Based around Arm's Neoverse V3 CPU cores, AGI is designed to power the next generation of agentic AI servers#ARM #ArmAGI #HotChips2026 #NeoverseV3
Arm's AGI Data Center CPU at Hot Chips 2026 -
Fujitsu’s Arm-based Monaka Data Center CPU at Hot Chips 2026
At Hot Chips 2026, Fujitsu outlined its upcoming Monaka CPU, a highly efficient Arm-based CPU for data centers and AI workloads#Fujitsu #HotChips2026 #Monaka
Fujitsu's Arm-based Monaka Data Center CPU at Hot Chips 2026 -
At Hot Chips 2026, NVIDIA went into detail on its upcoming Vera server CPU, and the Olympus CPU architecture. With 88 cores per chip, NVIDIA has ambitious aims for its in-house designed CPU architecture#CPU #HotChips2026 #NVIDIA #Vera
NVIDIA Vera CPU at Hot Chips 2026 -
Hot Chips 2026: CUDA Targets RISC-V – By Chester Lam
https://chipsandcheese.com/p/hot-chips-2026-cuda-targets-risc
Comments: https://news.ycombinator.com/item?id=49422548
#HackerNews #HotChips2026 #CUDA #RISC-V #ChesterLam #TechnologyNews
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At Hot Chips 2026, Intel went deeper into its newest budget SoC design, Wildcat Lake, which is being used in consumer and edge devices#CoreSeries3 #HotChips2026 #Intel #WildcatLake
Intel Core Series 3 (Wildcat Lake) CPU at Hot Chips 2026 -
Hot Chips 2026: Applying High Bandwidth Flash (HBF)
https://chipsandcheese.com/p/hot-chips-2026-applying-high-bandwidth
Comments: https://news.ycombinator.com/item?id=49420592
#HackerNews #HotChips2026 #HighBandwidthFlash #TechInnovation #Semiconductor
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At Hot Chips 2026, d-Matrix showed off its Raptor 3D-DRAM accelerator for AI breaking free of using HBM for memory by stacking DRAM and logic#d-Matrix #HotChips2026 #Raptor
d-Matrix Raptor 3D-DRAM Accelerator for Generative Inference at Hot Chips 2026 -
At Hot Chips 2026 SK hynix presented some of the challenges around HBM and packaging the memory for AI accelerators#HBM #HotChips2026 #SKHynix
SK hynix HBM Packaging at Hot Chips 2026 -
At Hot Chips 2026, Samsung discussed how it plans to evolve the HBM base die to free up more package area for mroe efficient compute#HBM #HotChips2026 #samsung
Samsung Evolving HBM Base Die at Hot Chips 2026 -
At Hot Chips 2026, Micron discussed how memory architectures are evolving for AI and some of the current packaging opportunities#HotChips2026 #Micron
Micron Evolving Memory Architectures for AI at Hot Chips 2026