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#lowna — Public Fediverse posts

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  1. #ASML sets new #EUV chipmaking density record, proposes #HyperNA tools and radical EUV speed boosts
    SML’s standard #LowNA EUV machines can print critical dimensions of 13.5nm, and the new #HighNA #EXE5200 EUV tool is designed to create even smaller transistors by printing #8nm features.
    They also outlined a plan to reduce EUV chipmaking costs by radically boosting the speed of future ASML tools to 400 to 500 wafers per hour, more than double the current peak of 200 wph.
    tomshardware.com/pc-components

  2. #ASML sets new #EUV chipmaking density record, proposes #HyperNA tools and radical EUV speed boosts
    SML’s standard #LowNA EUV machines can print critical dimensions of 13.5nm, and the new #HighNA #EXE5200 EUV tool is designed to create even smaller transistors by printing #8nm features.
    They also outlined a plan to reduce EUV chipmaking costs by radically boosting the speed of future ASML tools to 400 to 500 wafers per hour, more than double the current peak of 200 wph.
    tomshardware.com/pc-components

  3. sets new chipmaking density record, proposes tools and radical EUV speed boosts
    SML’s standard EUV machines can print critical dimensions of 13.5nm, and the new EUV tool is designed to create even smaller transistors by printing features.
    They also outlined a plan to reduce EUV chipmaking costs by radically boosting the speed of future ASML tools to 400 to 500 wafers per hour, more than double the current peak of 200 wph.
    tomshardware.com/pc-components

  4. #ASML sets new #EUV chipmaking density record, proposes #HyperNA tools and radical EUV speed boosts
    SML’s standard #LowNA EUV machines can print critical dimensions of 13.5nm, and the new #HighNA #EXE5200 EUV tool is designed to create even smaller transistors by printing #8nm features.
    They also outlined a plan to reduce EUV chipmaking costs by radically boosting the speed of future ASML tools to 400 to 500 wafers per hour, more than double the current peak of 200 wph.
    tomshardware.com/pc-components

  5. #ASML sets new #EUV chipmaking density record, proposes #HyperNA tools and radical EUV speed boosts
    SML’s standard #LowNA EUV machines can print critical dimensions of 13.5nm, and the new #HighNA #EXE5200 EUV tool is designed to create even smaller transistors by printing #8nm features.
    They also outlined a plan to reduce EUV chipmaking costs by radically boosting the speed of future ASML tools to 400 to 500 wafers per hour, more than double the current peak of 200 wph.
    tomshardware.com/pc-components